SEDANIA

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MATERIAL LITIGATION SEDANIA INNOVATOR BERHAD (“SEDANIA” OR "THE COMPANY") - KUALA LUMPUR HIGH COURT OF MALAYA (ORIGINATING SUMMONS NO.: WA-24NCC(ARB)-18-06/2023) - SETTLEMENT AGREEMENT

SEDANIA INNOVATOR BERHAD

Type Announcement
Subject MATERIAL LITIGATION
Description
SEDANIA INNOVATOR BERHAD (“SEDANIA” OR "THE COMPANY") 
-	KUALA LUMPUR HIGH COURT OF MALAYA (ORIGINATING SUMMONS NO.: WA-24NCC(ARB)-18-06/2023)
-	SETTLEMENT AGREEMENT

Reference is made to the Company's announcement dated 22 September 2023, 26 September 2023, and 29 November 2024, in relation to the above matter. Unless otherwise stated, the definitions and terms used herein shall have the same meaning as defined in the previous announcements.

 

The Board of Directors wishes to announce that Sedania Corporation Sdn Bhd ("SCSB") has reached an out of court settlement with Karine Low and Tan Kien Yeow (the “Plaintiffs”). Offspring Inc Sdn Bhd (“OFFSPRING”) a subsidiary of the Company and a party to the case, has also signed the Settlement Agreement (“SA”) on 7 February 2025.

 

Messrs David Gurupatham and Koay, solicitor of the Plaintiffs confirmed on 10 February 2025 that the SA shall operate as the full and final settlement and the Plaintiffs shall not have any claims, actions, demands and/or proceedings against SCSB and/or OFFSPRING in respect of the released matters.

 

In accordance with the terms of the SA, SCSB shall fulfill the agreed obligations and will continue to indemnify OFFSPRING and the Company against any claims relating to it.  Since the above matter has been concluded, it shall have zero impact on the financial and operations of OFFSPRING.

 

The Company wishes to assure shareholders that it remains committed to safeguarding the interests of the Company and its subsidiaries.

 

 

This announcement is dated 12 February 2025.






Announcement Info

Company Name SEDANIA INNOVATOR BERHAD
Stock Name SEDANIA
Date Announced 12 Feb 2025
Category General Announcement for PLC
Reference Number GA1-12022025-00014